Fibics Pattern
About Us
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Fibics Incorporated is a privately owned company specializing in materials science and semiconductor focused ion beam (FIB) applications and analytical services.
Our services include:
  • Micromachining and high resolution FIB sectioning and imaging of semiconductors, metallurgical specimens, and advanced materials;
  • Semiconductor device modification;
  • Site-specific TEM sample preparation and TEM/AEM/STEM analysis;
  • SIMS dopant and isotope analysis;
  • Probe pad deposition and failure analysis;
  • Plastic package and BGA integrated circuit decapsulation.
  • Fibics' experienced staff and state-of-the-art analytical instruments mean that we can provide you with solutions that meet your semiconductor or materials science needs at competitive prices and with timely results.
    Founded in 1996, we operate from the campus of the Canadian Government's Materials Technology Laboratory (MTL), which gives us access to a host of additional analytical equipment and expertise that our trained operators can use when solving your problems.
    Extensive High-End Analytical Equipment and Experience
  • Three state-of-the-art FIB systems: two ~$1M Micrion 2500 Focused Ion Beam (FIB) microscope systems and an ~$3M FEI/Micrion 986 FC Vectra "FlipChip" FIB, all with 50 kV, 5 nm columns and a full set of process gases (W, TMCTS (Siloxane), XeF2, Cl2, Br2, O2, H2O etc.);
  • Atomika 4500 Ultra-Shallow SIMS (Cs, O, Ga columns - suitable for ultra-shallow depth profiling with Cs & O, and high resolution SIMS imaging with Ga, as well as fundamental investigation of Ga FIB phenomena);
  • ~$250,000 additional specimen preparation equipment (optical microscopes, digital imaging systems and software, plastic package decapsulator, backside / parallel polisher, "Lift-Out TEM" tool, etc.);
  • Access to ~$12M high end analytical equipment on-site at the Canadian Goverments's Materials Technology Laboratory (FE TEM, SEM, Magnetic Sector (Cameca) SIMS, XPS, EPMA (WDS), Auger, etc.);
  • Team of scientists and engineers with an average of more than 10 years of experience each in materials or semiconductor characterization.
  • Strong Links to the Semiconductor Community
    We provide over 2,000 hours of circuit edit / device modification ("microsurgery") to our clients every year, all with fast turnaround, and working on all metal levels of the latest technologies. We also spend hundreds of hours each year on optimization of our techniques and keeping abreast of the latest developments in the field.
    Familiarity with State-of-the-art Semiconductor Devices
    We prepare & analyze TEM samples from dozens of manufacturers (in Si, GaAs, InP, InGaAsP, GaN, SOS, SOI, etc.), and perform microsurgery on 7 metal, 0.15 um technology devices fabricated at international locations.
    Excellent Links to Industrial Materials Science Clients
    We are a leader in the field of FIB applications to materials science, particularly with regard to TEM specimen preparation to solve complex metallurgical problems. We have extensive experience working with U.S. and European government agencies and research labs, as well as large industrial companies - particularly in the fields of advanced materials and corrosion of a range of metallurgical systems.
    History of R&D, Applications Development & Partnerships
    Fibics recently developed and sold technology (patent pending) for uniform milling of Copper Interconnect during microsurgery. Fibics has a keen interest in the history of developing novel applications, either under confidentiality agreements or for the purpose of publishing research results to expand the FIB field.
    90% of our work is in the field of "real-world, commercial problems." Our work focuses mainly on industrially relevant problems and solutions. Concurrently, we maintain a very strong R&D program.


    Please contact us if you have further questions.